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A mixed signal receiver IC for C-band radars is presented. The design work has been focused on spectral purity and miniaturization. Miniaturization is achieved by minimizing peripheral components and control signals using internal calibration data and temperature compensation tables stored in RAM on-chip. This allows for the packaged chip to be used with a minimum of. The chip is manufactured by Austria Microsystems in their 0.35µm SiGe-BiCMOS process and utilizes digital IP-block included in the design kit.

ha • kan berg, heiko thiesies and niklas billstro ¤mLow-cost enabling technologies for T/R modules (TRMs) in phased array radars are proposed and analyzed in terms of technology, performance, and cost aspects. Phase and amplitude controlling integrated circuits (ICs) realized in a low-cost standard silicon process are demonstrated. The design of several ICs at the S-, C-, on X-band has shown that silicon germanium is a strong contender for gallium arsenide. This also applies to TRMs suited for military active phased array antenna (AESA) radars. The circuits presented in this paper are manufactured by austriamicrosystems in their 0.35 mm SiGe-BiCMOS process with an f T of around 70 GHz. A TRM packaging concept based on soldered surface-mount technology and organic substrates is also demonstrated. A cost analysis concludes that by using the proposed packaging concept and the SiGe core-chip technology, the TRM production cost can be potentially reduced by 70% compared to traditional ceramic hermetic packaging with core chip in GaAs technology.

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