Two in situ `nanoreactors' for high-resolution imaging of catalysts have been designed and applied at the hard X-ray nanoprobe endstation at beamline P06 of the PETRA III synchrotron radiation source. The reactors house samples supported on commercial MEMS chips, and were applied for complementary hard X-ray ptychography (23 nm spatial resolution) and transmission electron microscopy, with additional X-ray fluorescence measurements. The reactors allow pressures of 100 kPa and temperatures of up to 1573 K, offering a wide range of conditions relevant for catalysis. Ptychographic tomography was demonstrated at limited tilting angles of at least ±35° within the reactors and ±65° on the naked sample holders. Two case studies were selected to demonstrate the functionality of the reactors: (i) annealing of hierarchical nanoporous gold up to 923 K under inert He environment and (ii) acquisition of a ptychographic projection series at ±35° of a hierarchically structured macroporous zeolite sample under ambient conditions. The reactors are shown to be a flexible and modular platform for in situ studies in catalysis and materials science which may be adapted for a range of sample and experiment types, opening new characterization pathways in correlative multimodal in situ analysis of functional materials at work. The cells will presently be made available for all interested users of beamline P06 at PETRA III.
Diffusion welding is a special high‐tech solid joining technique. Most research was done and publications were written in the years between 1970 and 1980. The aim of this paper is to take a closer look at the fundamental processes inside the material during diffusion welding and to discuss the relation between the materials microstructure for diffusion processes from a material science point of view. For this, it is necessary to discuss the impact of different lattice defects and to observe the intrinsic energetically conditions of a metal originating from its delivery state and manufacturing history, as well as its surface condition. In particular, emphasis is paid to the special requirements for joining of micro process devices.
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