A 128×128 three-dimensional MEMS optical switch module and a switching-control algorithm for high-speed connection and optical power stabilization are described. A prototype switch module enables the simultaneous switching of all optical paths. The insertion loss is less than 4.6 dB and is 2.3 dB on average. The switching time is less than 38 ms and is 8 ms on average. We confirmed that the maximum optical power can be obtained and optical power stabilization control is possible. The results confirm that the module is suitable for practical use in optical cross-connect systems.

SUMMARYAs a next-generation film carrier packaging technique intended for applications to high-speed large-capacity optical modules, OE-COF (Optoelectronic Chip on Film) packaging is proposed, in which LSIs and optical devices are installed on an optoelectronic compound film (OE film) by means of solder bumps. Its realizability is discussed. A 10-channel VCSEL of the 0.85-µm band with a 250-µm pitch is flip-chip mounted on an OE film by using thirty-six 80% Au-Sn solder bumps with a diameter of 40 µm. In regard to the basic configuration that couples an optical waveguide via a 45° mirror formed on the OE film, a mechanically strong flip-chip mounting of the VCSEL on an OE film and a low-loss optical coupling structure of the VCSEL and the OE film are discussed. As a result, a lowthermal-expansion OE film (11 × 10 -6

No abstract

No abstract

No abstract