We discuss the ultraviolet (UV) photo-field effects in amorphous InGaZnO 4 thin-film transistors (a-IGZO TFTs) compared with those in hydrogenated amorphous silicon (a-Si:H) TFTs. It is shown that the UV illumination induces a much more significant threshold voltage (V t ) decrease and OFF-current increase for the a-IGZO TFTs than for the a-Si:H TFTs. The significant V t decrease is found to take several tens of min to return to the initial state after switching off the UV light. A qualitative model is introduced to explain the photoresponse unique to the a-IGZO TFTs.

The transfer characteristics of amorphous InGaZnO 4 thin-film transistors (a-IGZO TFTs) were measured at temperatures ranging from 298 to 523 K in order to analyze the behavior of the above-threshold (ON state) and subthreshold regions. For comparison, the transfer characteristics of a hydrogenated amorphous silicon TFT (a-Si:H TFT) were measured in the same temperature range. We developed a simple analytical model that relates the threshold voltage (V t ) decrease due to increasing temperature to the formation of point defects in a-IGZO. It is well known that the formation of point defects results in the generation of free carriers in oxide semiconductors. Incorporating the analytical model with the experimental transfer characteristics data taken at high temperatures over 423 K, we estimated the formation energy to be approximately 1.05 eV. The V t decrease because of the generation of point defects is peculiar to a-IGZO TFTs, which is not observed in a-Si:H TFTs. The results for the ON-current activation energy suggested that the density of tail states for a-IGZO is much lower than that for a-Si:H. #

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This paper describes a method for utilizing an excimer laser to improve the characteristics of InGaZnO 4 (IGZO) thin-film transistors (TFTs). IGZO-TFTs fabricated at room temperature are irradiated with an excimer laser to raise the temperature of the IGZO films for only a very short time, some tens of ns. The ON current of an irradiated IGZO-TFT is more than one order of magnitude higher than that of an unirradiated TFT. This method is promising for achieving high performance IGZO-TFTs on plastic substrates because the thermal damage to substrates will be much less than that which would result from furnace annealing.

We have investigated an excimer laser annealing (ELA) process for use in fabricating high-performance amorphous InGaZnO 4 (IGZO) thinfilm transistors (TFTs) on flexible plastic substrates. We numerically estimate the temperature increase of the IGZO film and substrate as a function of laser energy density. This is one of the most important measures for optimizing ELA conditions in order to apply plastic-based TFT fabrication. Because the optical absorption coefficient of IGZO film is three orders of magnitude higher than that of plastic substrates with respect to 308-nm laser light, it is possible to selectively increase the temperature of the IGZO film. The temperature of the IGZO film is estimated to increase to approximately 1500 C at typical laser energy levels. Furthermore, incorporating a SiO 2 buffer layer (some hundreds of nm) between the IGZO film and the plastic substrate is found to effectively suppress thermal damage to the substrate. We have experimentally investigated the properties of IGZO films irradiated with various excimer-laser energy densities. X-ray diffraction patterns and carrier densities of the IGZO films are found to significantly vary with laser energy density. We have used calculations and experimental results to optimize the ELA process; this has enabled us to produce high-performance IGZO-TFTs having a field-effect mobility of 15.6 cm 2 V À1 s À1 . #