In the present research, in order to fundamentally investigate the strength and interfacial microstructure of the joints between Sn-3.5Ag-0.7Cu (SAC) and Sn-8Zn-3Bi (SZB) solders and Cu, examinations using the standardized solder joint specimen for measuring the shear strength were performed. The effects of the addition of Ag, Bi and Pb to the solders, which are the ingredients of possible lead plating materials of quad plat package, solder layer thickness and aging treatments ranging from 358 to 423 K were investigated. The SAC base solder joints, whose strength hardly degraded after aging, were more reliable than the SZB base solder joints. Since no detrimental effect of the Bi or Pb addition was recognized, the lead plating materials are found to have no significant effect on the strength of the SAC solder joints. Although the SZB base solder joints had higher strength than the SAC base solder joints in as-soldered condition, a significant degradation of the joint strength occurred after aging. In the case of thinner solder layer of 20 mm, the Cu 6 Sn 5 layer that formed at both the solder/Cu 5 Zn 8 and Cu 5 Zn 8 /Cu interfaces after aging caused the fracture of the solder joints and resulted in the degradation of the joint strength. In the case of thicker solder layer of 100 mm, the Cu 5 Zn 8 interfacial layer continuously grew during aging, which caused the fracture of the solder joints and resulted in the decrease in the joint strength. As for the effect of the addition elements, while Pb addition caused a marked degradation of the joint strength, Ag addition and Bi addition had no detrimental effect on the strength of the solder joints. In particular, the joint with the Ag addition solder had the better strength in the case of thinner solder layer. Thus, as for lead plating for the SZB solder, Sn-Pb should be avoided and Sn-Bi or Sn-Ag as Pb-free plating has no detrimental effect on the joint strength. In particular, Sn-Ag plating is preferable in the viewpoint of the joint strength. q

Abstract

No abstract

Ulcerative colitis (UC) is a non-specific inflammatory bowel disease that causes ulcers and erosions in the colonic mucosa and becomes chronic with cycles of amelioration and exacerbation. Because its exact etiology remains largely unclear, and the primary therapy is limited to symptomatic treatment, the development of new therapeutic agent for UC is highly desired. Because one of the disease pathogenesis is involvement of oxidative stress, it is likely that an appropriate antioxidant will be an effective therapeutic agent for UC. Our silicon (Si)-based agent, when ingested, allowed for stable and persistent generation of massive amounts of hydrogen in the gastrointestinal tract. We demonstrated the Si-based agent alleviated the mental symptom as well as the gastrointestinal symptoms, inflammation, and oxidation associated with dextran sodium sulfate-induced UC model through Hydrogen and antioxidant sulfur compounds. As the Si-based agent was effective in treating UC in the brain and large intestine of mice, it was considered to be capable of suppressing exacerbations and sustaining remission of UC.