We introduce the novel carbon nanoparticles with specific structure and feature. They are made from precursors of polyacrylonitrile(PAN)-based polymer in the original process. The shape and structure of the derived carbon products, which are designed by selecting the size and molding the precursors of polymer, are very uniform. Also, these particles showing their forms individually, have the excellent dispersibility in some mediums and show the functional property. Since they can be prepared corresponding to the applications, they are expected to be developed to many applications by practically using their functions and properties.

Novel thermotropic liquid crystalline semi-aliphatic polyimide containing polysiloxane unit has been developed. The polyimide film exhibits high thermal stability and liquid crystallinity with lower transition temperature. Poly(amic acid) solution used as a precursor of the polyimide has very good surface wetting properties for a silicon wafer, resulting in homogeneous polyimide thin film formation on the wafer after thermal imidization below 200 °C. The silicon wafer coated with the polyimide thin film can be bonded to another silicon wafer, or to another polyimide film on heating at 270 °C with relatively low pressure. Moreover the bonding is repairable on heating again. It is proposed that the polyimide can be utilized as a polymer adhesive for three dimensional chip stack.