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Based on extended finite element coupled with field variable method, fatigue damage numerical test of three point-bending beam with initial notch has been made to predict crack propagation path, numerical results showed : under the fatigue loading with 200Hz, and amplitude is 20KN, length of crack expanding was the biggest and crack grew as some angles with the initial crack during the first loading, crack propagated parallel to the initial angle during the other loading cycle. These results can fit the experiment very well. Using Fortran, A new user subroutine named USDFILD (User subroutine to redefine field variables at a material point) was also provided on the platform of ABAQUS, which can modal the change of physic material with time. This user subroutine can also import fatigue characterize of material into the model.

Static liquefaction is one of the main causes of flow slide destruction in tailings pond. This paper analyzed the static liquefaction behaviors in tailings pond through the development of displacement, deformation and pore pressure ratio. Based on the simulation results, some conclusions were obtained. Fast discharge of tailings will fasten the increase of pore pressure. The dam-toe in tailings pond is very easy to be eroded, leading to introverted destruction. The liquefaction of sand layer in foundation would cause the tailings dam’s slip failure. With the arising of tailings, pore pressure increased continuously expanding to the foundation under the dam.

Wettability and interfacial characteristic of the Sn-3.0Ag-0.5Cu/Ni system are investigated by sessile drop method at the temperature range of 503~673K. The reactive wetting processes demonstrate that: contact angles between the solder and Ni substrate decrease as exponential decay and the equilibrium contact angles decrease monotonously with the temperature increasing. Triple-line mobility is enhanced as the temperature increases. Interface of the Sn-3.0Ag-0.5Cu /Ni interface are identified by EPMA and EDS analysis as (Cu,Ni)6Sn5 adjacent to the solder and Ni3Sn4 adjacent to the Ni substrate, respectively. Cu is condensed at the interface, the composition of (Cu,Ni)6Sn5 is (23.16~23.46)Ni- (36.56~37.52) Cu-(39.02~40.27)Sn (atom %). The formation of the (Cu,Ni)6Sn5 IMC was known to greatly improve the reliability of the solder joints in integrated circuits.

Numerical simulation of vibro-stone column is taken to simulate the installation of vibro-stone column. A relationship based on test is adopted to calculate the excess pore pressure induced by vibratory energy during the installation of vibro-stone column. A numerical procedure is developed based on the formula and Terzaghi-Renduric consolidation theory. Finally numerical results of composite stone column are compared single stone column.