Alkanethiolate films were used as templates for patterned electrodeposition of metal structures with micrometer dimensions. Two patterning schemes were implemented, contact printing of a C~6H33SH film and mechanical scribing micrometer wide grooves in a self-assembled CIeH33SH monotayer film. A thin film of nickel was then electrodeposited on film-free areas of the copper and gold substrates. The alkanethiolate template can also be used as a mask for chemical etching. This was demonstrated by etching C~eH33SH patterned copper substrates. More complex structures can be built by combining, both deposition and etching processes.Interest in the science and technology of surface adsorption of organic monolayer films has grown tremendously over the last decade. ~ The ability to tailor both the head and tail groups of the constituent molecules makes such films ideal for gaining more insight into interfacial phenomena and offers technological opportunities ranging from biosensors to corrosion control applications. Several reports have appeared demonstrating the viability of patterning self-assembled monolayers (SAMs) for a variety of functional applications. Patterning may be accomplished by photo-oxidation, 2 contact printing, 3 pen writing, 4 electron beam, 5 ion beam, s physical abrasion, 7 and STM-based methods, e These developments have been driven by the concept that the ultimate pattern resolution should be determined by the size of the constituent molecules that comprise the two-dimensional quasi-crystalline array. In this report we are interested in the application of such pat-* Electrochemical Society Active Member.

Applying ultrasound to the electroplating process can improve mechanical properties and surface roughness of the coating. Supercritical electroplating process can refine grain to improve the surface roughness and hardness. However, so far there is no research combining the above two processes to explore its effect on the coating. This study aims to use ultrasound (42kHz) in supercritical CO (SC-CO) electroplating process to investigate the effect of ultrasonic powers and supercritical pressures on the properties of copper films. From the results it was clear that higher ultrasonic irradiation resulted in higher current efficiency, grain refinement, higher hardness, better surface roughness and higher internal stress. SEM was also presented to verify the correctness of the measured data. The optimal parameters were set to obtain the deposit at pressure of 2000psi and ultrasonic irradiation of 0.157W/cm. Compared with SC-CO electroplating process, the current efficiency can be increased from 77.57% to 93.4%, the grain size decreases from 24.34nm to 22.45nm, the hardness increases from 92.87Hv to 174.18Hv, and the surface roughness decreases from 0.83μm to 0.28μm. Therefore, this study has successfully integrated advantages of ultrasound and SC-CO electroplating, and proved that applied ultrasound to SC-CO electroplating process can significantly improve the mechanical properties of the coating.

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, "Errata: Fabrication of through-silicon via arrays by photo-assisted electrochemical etching and supercritical electroplating,"