The prognosis and management of machine health statuses are emerging research topics. In this study, the performance degradation of a wafer-handling robot arm (WHRA) was predicted using the proposed machine-learning approach. This method considers the eccentric vertical and planar position deviations from a wafer mark using a charge-coupled device (CCD) camera. Synthesized position signals were defined using the square root of x- and y-axes deviations in the horizontal view and the square of the wafer mark diameter in the vertical view. A feature extraction method was used to determine the position status on the basis of these displacements and the area of a wafer mark in a CCD image. The root mean square error and mean, maximum, and minimum of the synthesized position signals were extracted through feature extraction and used for data mining by a general regression neural network (GRNN) and logistic regression (LR) models. The lifetime assessment by confidence value of the WHRA’s remaining useful life (RUL) by the genetic algorithm/GRNN exhibited nearly the same trend as that predicted through a run-to-failure LR model. The experimental results indicated that the proposed methodology can be used for proactive assessments of the RUL of WHRAs.