Electrical performance of bonding wire is critical to the reliability of electrical interconnection systems of chip-level packaging for high frequency operation. In this paper, the electrical performance of various bonding wires between chips and packages is presented. The impact of the length, spacing, height and diameter between the bonding wires was carefully examined. In order to investigate the impacts of bonding wire configuration parameters on signal transmission performance, a design of experiment (DOE) was set up. Based on data of DOE, two parameter equations were obtained to express the Radio Frequency characterization of bonding wires. From these equations, the optimized geometric structure parameters were obtained by optimization design. Compared with the previously reported geometric structure, the optimized geometric structure has better electrical performance, making the return loss and coupling decrease 3dB and more than 10 dB, respectively.