No abstract

The overflow fusion process was an important method for the manufacture of glass sheet that is currently used for the production of TFT/LCD display devices. The design of forming apparatus was critical for very high surface quality of glass to allow the successful application of semiconductor type material. However, there is only a little of researches had been presented in the literatures, because of difficulties and expansions in experiments. In this study, a numerical model for simulation of molten glass flow through the isopipe during overflow fusion process was carried out. The effect of temperature of forming apparatus and of molten glass on the flow patterns during overflow fusion process was investigated. It was found that the stability and flatness of sheet glass was influenced strongly by the temperature of forming apparatus and molten glass. A precise control of overflow temperature and temperature distribution of isopipe was needed for maintaining a stable flow and uniform thickness.

multilayer films with Pt bottom and top electrodes have been prepared by a double target radio frequency (RF) magnetron sputtering, and their dielectric properties have been characterized as a function of temperature, frequency, bias voltage, and applied voltage. The X-ray diffraction (XRD) pattern reveals that the deposited (SrTiO 3 /BaTiO 3 ) n multilayer films have a designed modulation. The interfaces within the multilayer films appear smooth and dense without any microcracks, and the adhesion is very good. The dielectric constant of the (SrTiO 3 /BaTiO 3 ) n multilayer film increases with increasing layer number (n), and the leakage current density is less than 1 9 10 À8 AAEcm À2 for the applied voltage less than 5 V for the 450-nm-thick (SrTiO 3 /BaTiO 3 ) n multilayer films. The remanent polarization (P r ) and the coercive field (E c ) of the 350-nm-thick (SrTiO 3 /BaTiO 3 ) 4 multilayer films are 7 lCAEcm À2 and 60 kVAEcm À1 , respectively, exhibiting ferroelectricity. (SrTiO 3 /BaTiO 3 ) 4 multilayer films have a high E c and a lower P r , as compared with the bulk BaTiO 3 single crystal. The 450-nm-thick (SrTiO 3 /BaTiO 3 ) 4 multilayer films have a leakage current density-voltage characteristic, which makes them suitable for application in DRAMs capacitors.

The glass sealant with pre-forming frame structure, used for joining dissimilar materials of planar type SOFC devices, was fabricated by molding process. The flow phenomena during glass molding were investigated by computational modeling. The physical properties of glass sealant fluid were constructed in numerical models. The process parameters, such as mold pressing velocity, initial glass fluid temperature (or viscosity of glass sealant), and initial mold temperature, were examined. As results, the sealants formability could be characterized by molten glass temperature, near the gap between upper and lower molds. If the temperature is greater than its glass transformation temperature Tg, the formability become better, and vice versa. Keywords: solid oxide fuel cells (SOFCs), computational modeling, glass sealant.