The UHL-SO and UHL-RH conditions share a common or similar etiopathogenesis different from that of AHL. Imaging studies and genetic testing might be prioritized during the respective general etiologic workups for patients with UHL and AHL. Regular hearing checkups are warranted for patients with UHL and AHL because a certain proportion of patients might sustain progression in SNHL.

In this paper, the characteristics of polymeric packaging materials for Pre-mold QFN type CMOS Image Sensor (CIS) have been carefully investigated. Hygro-mechanical property, the coefficient of moisture expansion (CME) for different materials was measured through Thermal Mechanical Analysis (TMA) and Thermal Gravitational analysis (TGA) at given humidity and temperature. Moisture absorption/desorption diffusivity were determined under Arrhenius behavior. The transient moisture diffusion analysis described by Fick's equation is performed to evaluate the overall moisture distribution. In accordance with the JEDEC pre-conditioning standard JESD22-A120, reliability and thermal design were carried out due to mismatch of the coefficient of thermal expansion (CTE) and CME for multi-material package of CIS. A threedimensional solid model of CIS based on finite element ANSYS software is developed to predict the thermal-induced strain, hygroscopic swelling deformation and the residual thermo-hygro-mechanical stress distributions. A series of comprehensive parametric studies were conducted in this research.

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A novel submodel scheme based on St. Venant's principle has been developed to evaluate the reliability Thermal Cycle Test (TCT) for CMOS Image Sensor (CIS). The region of interested in board level CIS package is lead-free paste, which is the peak stressed area to predict fatigue life. A solid finite element model of CIS using ANSYS codes is developed to predict the thermal strain distributions. The predicted thermal-induced displacements were found to be very good agreement with the Moire interferometer experimental inplane u and v deformations. The developed finite element model is then applied to investigate the reliability of the JEDEC standard JESD22-A104 TCT. In order to save computational time and produce satisfactory results in the coarse region of interest, an independent more finely meshed so-called submodel scheme based on cut-boundary displacement method is generated. The mesh density for different area ratio of submodel/global model was verified and the results were found to be good agreement with previous researches. The modified Coffin-Manson equation is applied to evaluate the predicted fatigue life of SnAgCu pastes. A series of comprehensive parametric studies were conducted in this paper.

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