Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there is very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires. This paper investigated the transmission performance of single bare bonding wires and insulated bonding wires with different wire material, wire diameter, bonding height, insulation thickness at high frequency. The simulation analysis shows that when the frequency increases above 15Ghz, the effect of the geometric parameters has no significant different to the transmission performance. The thickness of the insulation between 0.1μm to 0.3μm reacted similar performance for return loss and insertion loss across all frequency

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The application of polyaniline (PANI) in flexible electronic devices has received increased attention due to its environmental stability, electrical conducting properties, and ease of production. While the electrical conductivity of a PANI film can be altered by modifying the number of PANI layers, this study aims to compare two techniques, namely ex-situ and in-situ, for the fabrication of PANI multilayer film. For the ex-situ technique, PANI was formed separately before being drop-casted on a filter paper; on the other hand, for the in-situ technique, polymerization of aniline into PANI and attachment of PANI on a filter paper was allowed to occur simultaneously. In both techniques, humic acid was used as the bridging agent. Results showed that the in-situ direct growth technique produced PANI multilayer film with good uniformity, lesser cracking, and detachment. On the other hand, the ex-situ drop-casting technique resulted in PANI film with very poor uniformity, irregular thickness, and severe detachment.