This
paper reports the synthesis of three novel titanium complexes
containing amidoxime ligands as potential precursors for titanium
nitride (TiN) thin films fabricated using atomic layer deposition
(ALD). A series of ligands, viz., N′-methoxy-N-methylacetimidamide (mnnoH), N′-ethoxy-N-methylacetimidamide
(ennoH), and N′-methoxy-N-methylbenzimidamide (pnnoH), were successfully synthesized and used
to produce Ti(mnno)(NMe2)3 (4),
Ti(enno)(NMe2)3 (5), and Ti(pnno)(NMe2)3 (6). Thermogravimetric analysis
curves of complexes 4–6 revealed
a single-step weight loss up to 200 °C. Pyrolysis occurred beyond
200 °C. Among the three new complexes, 5 was liquid
at room temperature. Therefore, TiN was synthesized by ALD using Ti(enno)(NMe2)3 (5) as a novel precursor. A TiN
thin film was deposited from the Ti(enno)(NMe2)3 (5) precursor and NH3 plasma, and self-limiting
growth was achieved by varying the injection/purge duration. TiN thin
film growths were observed with a growth per cycle (GPC) of 0.05–0.13
nm·cy–1 at deposition temperatures between
150 and 300 °C, while the measured resistivity was as low as
420 μΩ·cm. The high reactivity of the precursor promotes
nucleation, resulting in TiN thin films with smooth, good step coverage
and preferentially orientated microstructure.
Ru films are grown on Pt, TiN, and SiO2 substrates via atomic layer deposition (ALD) using Ru(II)(η5‐C7H7O)(η5‐C7H9) as the novel Ru metalorganic precursor and O2 as the reactant. The ALD self‐limiting film growth is confirmed at the low temperature of 200 °C by manipulating the injection time and purge time of the Ru precursor and O2, and the saturated growth per cycle is 0.22 Å cy−1. It is confirmed that the combustion reaction occurs during the deposition process from the formation of the H2O and CO2 by‐products. Thin films with a low resistivity of 17–19 µΩ cm are grown at a thickness of ≈15 nm. The Ru incubation times are remarkably short at 200 °C (negligible on Pt, ≈30 cycles on TiN and SiO2), but increase with increasing temperature. The energy dispersive X‐ray mapping image of the Ru film on the pattern in which TiN is formed on SiO2 shows that the Ru film with a novel precursor has the intrinsic substrate selectivity at the deposition temperature of 300 °C. Furthermore, the substrate affects the properties of the Ru film. Particularly because Ti serves as an oxygen reservoir, a relatively large amount of RuOx is produced on the TiN substrate.
Curved hydrogel surfaces bearing chemical patterns are highly desirable in various applications, including artificial blood vessels, wearable electronics, and soft robotics. However, previous studies on the fabrication of chemical patterns...
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