In FPD(Flat Panel Display) devices, the diamond wheel has been used to scribe glass by means of mechanical contact which needs grinding and cleaning process to remove particles, glass chips, surface crack and sharp edges. In recent years laser glass cutting technology has been researched which is different from the conventional method, cutting glass not by melting but by thermal shock. The laser glass cutting by thermal shock can produce crack in glass by surface cooling after laser heating on glass by means of stress slope on glass surface. When this technology is applied in FPD manufacturing devices, it has several advantages compared to conventional methods as follows; (a) Non-contact glass cutting : almost no glass chip occurs. (b) According to circumstances, grinding and cleaning can be omitted. (c) System maintenance can be simplified.

Micro-conductive patterns formed by selective electroless Ni-B plating process were fabricated to investigate the vanous distribution of the seed layer on insulating substrates. Selective distribution of the seed layer was forming through successive steps of laser ablation, activation treatment, mechanical polishing. A KrF Excimer laser (wavelengh of 248nm) ablation was carried out on the PMMA (Polymethymethacrylate), PET (Polyethylene Terephalate), PC (Polycarbonate) and P1 (Polyimide) substrates. The UV-vis spectrometer analysis showed that PMMA was a weaker absorber than other polymers at the wavelength of 248 nm. The geometrical shape of structure formed is affected by absorption coefficient. Surface morphology and characteristics after laser ablation and electroless plating is observed by Field Emission Scanning Electro Microscope (FE-SEM). As a increasing the depth of substrate patterned by laser ablation, plating was precise. Finally, we concluded this method to be suited for manufacturing micro-conductive patterns on insulating substrates without lithography.