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The temperature dependence of the electrical resistivity ρ of pure polycrystalline aluminum and copper after plastic deformation is investigated in the temperature interval 4.2–300 K. Using heat treatment as a tool for changing the crystallite size d and structural perfection of the sample, it is determined how ρ depends on the ratio of d to the electron mean free path le and on the degree of deformation of the Cu and Al. At temperatures below 10 K the ρ(T) curves of the deformed samples of polycrystalline copper and aluminum exhibit minima and maxima. At higher temperatures a more complicated dependence of ρ(d/le) is observed. It is found that in the region of the anomalous skin effect the experimentally determined and theoretically calculated values of the surface resistance Rs agree only in the case when the electron mean free path is smaller than the size of the crystallites.

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