A normally open piezoelectric actuated microvalve which modulates a gas flow is fabricated and tested. This work is based on the novel concept of combining micro-machining- and fine machining. The microvalve was tested for air flow. It is shown that a flow rate of 250 ml min−1 for a pressure difference of 4 bars can be achieved. The continuous and controlled flow of gas at any stage of valve operation can be obtained. Additionally, it has been shown that almost no hysteresis occurs during the valve operation and the power consumption is very low.

In this paper, we present the design, fabrication and characterization of a novel gas microvalve realized by combining micro-and fine-machining techniques. The design is for high flow rates at high pressure difference between inlet and outlet, burst pressure of up to 15 bars. There is no power consumption required for the valve to maintain its position during operation in any intermediate state and the process gas does not interact with the actuation mechanism. The microvalve was experimentally characterized with air flows. It is shown that flow rates of 220 ml min −1 at a pressure difference of 4 bars could be achieved with a minimum accurate flow rate of 4 ml min .

The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are presented. Results obtained, are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 pm thick silicon with glass tubes having outer diameter of 6 m and with wall thickness 2 mm, i s more than 60 bars after annealing at temperature of 800 O C

A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are discussed in terms of the homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 µm thick silicon, with glass tubes having an outer diameter of 6 mm and with a wall thickness of 2 mm, is more than 60 bars after annealing at a temperature of 800 • C.

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