Thin solid films consisting of ZrO2 and Ta2O5 were grown by atomic layer deposition at 300 °C. Ta2O5 films doped with ZrO2, TaZr2.75O8 ternary phase, or ZrO2 doped with Ta2O5 were grown to thickness and composition depending on the number and ratio of alternating ZrO2 and Ta2O5 deposition cycles. All the films grown exhibited resistive switching characteristics between TiN and Pt electrodes, expressed by repetitive current-voltage loops. The most reliable windows between high and low resistive states were observed in Ta2O5 films mixed with relatively low amounts of ZrO2, providing Zr to Ta cation ratio of 0.2.

While the main application of resistive switching structures currently targets non-volatile memories, increasing interest is being focused on their logic applications. Resistive switches are suitable for Boolean logic, neuromorphic computing and for implementation of Zadeh fuzzy logic. In this work, we analyzed implementation of the resistive switching structures for logic application based on Zadeh fuzzy logic. Resistive switching structures based on hafnium oxide and tantalum oxide were connected in an anti-serial configuration (complementary resistive switch). The complementary resistive switches integrated into logic circuit for Min-Max function implementation were analyzed using quasi-static voltage sweeps. We have shown that the accuracy of the Min/Max function determination depends on the ratio of the high and low resistivity states of the single switches. Determination of the Min/Max values is relevant only above the threshold voltage of the resistive structures. Reproducibility of the Min/Max function constructed from the resistive switching structures was evaluated. In addition, pulsed reconfiguration of complementary resistive switch using 100 ns long pulses was demonstrated.

are generated by a repetitive sequence of processing steps in which for each material a sacrificial resist layer is deposited, then patterned, then used to transfer its pattern into the desired material layer, and finally removed. This framework does not allow for the direct deposition of a patterned functional material. Its reliance on a small number of sacrificial "resists" and the multiple removal and cleaning steps cause large amounts of material waste. It also requires significant resources of energy, processing time, and facility investment. Additionally, lithography-based fabrication is highly suitable to the generation of identical products in large numbers, but it does not offer prompt access and flexibility to prototyping individual devices. In the manufacturing of large parts, prototyping has been rendered increasingly accessible using additive manufacturing (3D printing) strategies. [4][5][6][7][8] Here, the functional material is directly deposited in patterned form using various strategies such as miniaturized nozzles and laser or electron beams. However, so far the resolution (the smallest feature size controllable) has been on the order of hundreds of micrometers, although the integration of nanostructures into 3D-printed materials or patterns is possible. [9][10][11][12][13][14][15][16][17][18] In other words, 3D printing is several orders of magnitude away from the feature sizes accessible by lithographic methods. In summary, 3D printing has the direct pattern generation capability and materials versatility, whereas Additive manufacturing (3D printing) has not been applicable to micro-and nanoscale engineering due to the limited resolution. Atomic layer deposition (ALD) is a technique for coating large areas with atomic thickness resolution based on tailored surface chemical reactions. Thus, combining the principles of additive manufacturing with ALD could open up a completely new field of manufacturing. Indeed, it is shown that a spatially localized delivery of ALD precursors can generate materials patterns. In this "atomic-layer additive manufacturing" (ALAM), the vertical resolution of the solid structure deposited is about 0.1 nm, whereas the lateral resolution is defined by the microfluidic gas delivery. The ALAM principle is demonstrated by generating lines and patterns of pure, crystalline TiO 2 and Pt on planar substrates and conformal coatings of 3D nanostructures. The functional quality of ALAM patterns is exemplified with temperature sensors, which achieve a performance similar to the industry standard. This general method of multimaterial direct patterning is much simpler than standard multistep lithographic microfabrication. It offers process flexibility, saves processing time, investment, materials, waste, and energy. It is envisioned that together with etching, doping, and cleaning performed in a similar local manner, ALAM will create the "atomic-layer advanced manufacturing" family of techniques.The ORCID identification number(s) for the author(s) of this article can be found und...