Polymer light-emitting diodes (PLEDs) have attracted growing interest in recent years for their potential use in displays and lighting fields. Nevertheless, PLED devices have some disadvantages in terms of low optoelectronic efficiency, high cost, short lifetimes and low thermal stability, which limit their final applications. Huge efforts have been made recently to improve the performances of these devices. The addition of inorganic or hybrid organic-inorganic nanoparticles to the light-emitting polymers, for example, allows their thermal stability and electroluminescent efficiency to be increased. Following this approach, novel PLED devices based on composite films of PPV-derivative copolymer (commercial name Super Yellow, SY) and octaisobutil POSS, were developed in this study. The device containing Super Yellow loaded with 1 wt% of POSS showed higher efficiency (ca. +30%) and improved lifetime in comparison to PLED prepared with the pure electroluminescent polymer. The PLED devices developed in this study are suitable candidates for automotive dashboards and, in general, for lighting applications.

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The use of various H2O2 based chemistries for TiW etch was studied on single wafer and wet bench tools. The focus of the investigation was put on the different behaviors of these chemicals on blanket and patterned wafers. The results of the etch rate tests showed much higher values on the wafers where copper was exposed, leading to the hypothesis that the etch rate on TiW should be driven by the catalysis effect of the transition metal on the H2O2 decomposition reaction. Additional optical inspections, ToF SIMS, SEM and TEM analyses were carried out to confirm this hypothesis and find the best conditions in terms of morphology for RDL applications. Finally, the collected data were also used to evaluate the process cycle time and cost of ownership.

Electroless Ni deposition is often used in presence of Cu, Ti and Au. Recently TiW has also started to be employed, but with this alloy the Ni deposition is not always neat. In our work we investigate the effect of different wet treatments on the Ni growth by means of XPS analyses and SEM inspections. It is found that an oxidized surface inhibits the activator deposition. The de-oxidized Ti atoms in TiW on the other hand are believed to act as the principal sites for Pd seed deposition and subsequent Ni growth.

The defectivity of a batch process for polymer removal in AlCu BEOL technology has been investigated, reasearching the defectivity source and studying the composition of the defects. Different solutions for the minimization of this defectivity have been found, working on the positioning of the wafers or additional cleanings. The complete eradication of the defectivity has also been demonstrated performing the process on a single wafer tool.