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Distributed Filament Contacts (DFCs) are an emerging class of non-metallic, electrical contacts which are technically interesting and commercially useful. Conductive carbon fiber filled composites are pultruded, then laser or waterjet processed into contact surfaces that are rich in oriented and continuous carbon fiber that is distributed across the entire contact face and available to conduct current across a separable interface. The combination of a high degree of contact-spot redundancy, low mating force, and predictable contact resistance makes these contacts acceptable for certain applications requiring high reliability. This paper discusses the features and physics of novel Distributed Filament Contacts which have been developed for use as slip ring devices.

This paper presents a model for electrical carbon fiber contacts. In the model, a statistically distributed fiber length was considered at contact surfaces. A technique of dealing with this kind of contact surfaces with statistically determined, or specifically undeterminable, geometry was developed. The results were compared with the experimental data obtained previously. Also, the contact behaviors of electrical carbon fiber contacts were discussed and some specific contact properties, which were also observed experimentally, were clarified. A contact resistance decreasing rate was defined in a logarithmic-logarithmic scale coordinate. A constant-rate contact region was identified. The objective of this research is to provide a theoretical basis for the contact surface designs of electrical connectors.

This paper presents a new type of grid array electrical interconnect that uses carbon fiber as the conductive medium. Characterization of the electrical properties suggest that carbon fiber-based interconnects can be applied across different packaging levels, such as semiconductor die to substrate, integrated circuit package-to-board and board-to-board interconnections. Multiple interconnect contacts have been integrated to provide multiple interconnections within a single assembly. Each interconnect contact consists of a large number of carbon fibers which can act cooperatively to provide a high degree of reliability and predictability to the interconnect function. An optional metal coating, such as nickel, copper, aluminum or gold, can be applied over the carbon fibers to enhance conductivity and solderability. These novel interconnects can be joined to conventional circuitry by several techniques including pressure/physical contact, solder, and conductive adhesives (U.S. Patent 007 220 131).

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