In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

Fasteners are used to join the various electronic products and machines. So, the quality and reliability of the fastener are strongly requested. In this study, the analyses of the multi-stage cold forging of TORX screws for storage parts are carried out. In manufacturing of TORX screws, crack and folding defects are observed. Therefore, the analysis is focused on the prediction of the defects. Based on the analysis results, the upper die and process conditions are redesigned to reduce the defects. The upper die shape for preform forming is redesigned to prevent folding and sharp shape change. The Cockroft-Latham damage criterion is introduced to predict the crack initiation. Analysis results shows that the maximum Cockroft-Latham damage value is decreased by 40% in the forming using the modified upper die.

Recently, with the merits of simplicity, ease of mass production and cost effectiveness, a roll-to-roll (R2R) forming process is tried to be employed in the manufacturing of the circuit board, barrier ribs and other electronic device. In this study, the roll-to-roll process for the forming of micro-pattern in electronic device panel is designed and analyzed. In the preliminary experiments, two major defects, i.e., crack near the dimple wall and wrinkling on outside region of dimple, are found. The study on the crack prevention is carried out in previous works by authors. In this study, the cause of wrinkling and modification of tooling to prevent the wrinkling is studied. The main cause of wrinkling is considered to be the uneven material flow along the rolling direction. To reduce or to retard the wrinkling initiation, a dummy shape on outside the pattern is introduced. From the finite element analysis results, it is shown that the dummy shape can reduce the uneven material flow significantly. Finally the effect of dimensions of the dummy shape on material flow is investigated and the optimum dimensions are found.

Roll-to-roll forming process is one of important metal processing technology because the process is simple and economical. These days, with these merits, roll-to-roll forming process is tried to be employed in manufacturing the circuit board, barrier ribs and solar cell plate. However, it is difficult to apply to the forming of micro scale or sub-micro scale pattern. In this study, the roll forming processing for the micro scale is designed and analyzed. The forming of micro pattern for small electric device such as LCD panel by incremental roll forming process is analyzed. Firstly, the optimum analysis conditions are found by several analyses. And then, formability is analyzed for various protrusion shapes at various forming temperatures. The formability is evaluated in terms of filling ratio and damage value. The filling ratio is defined from the tool geometry and critical damage is determined from the analysis of uniaxial tensile test. Finally, optimum forming conditions that guarantee the successful forming are found.