In this study, we produced Au-Sn alloy electroplated from a single solution and optimized the composition. The composition of electroplated Au-Sn alloy was Au-31.02 at.% Sn at the condition of 6 ms on -4 ms off pulse current, 50 and 10 mA/cm 2 . Results in XRD analysis showed that Au-Sn alloy electroplated at DC 10 mA/cm 2 had AuSn phase (ξ′) only and Au 5 Sn phase (δ) appeared with decreasing the pulsed current on time. Also micropatterned Au-Sn solder bump was produced by photolithography. Though it's composition of at.% Sn was not optimum, we tried to bond between Au-Sn solder bump and Si wafer that was coated with Ti (100 nm)/Au (300 nm).

We have investigated the magnetic properties and the microstructures of Mn-Ir/Ni-Fe/(Ta, Cr)/Si exchange biased multilayers. The Mn-Ir/Ni-Fe on a Ta buffer layer exhibited a higher exchange biased field than the Mn-Ir/Ni-Fe on a Cr buffer layer. On the other hand, the Mn-Ir/Ni-Fe on a Cr buffer layer exhibited a higher blocking temperature and was composed of larger grains than Mn-Ir/Ni-Fe on a Ta buffer layer. Both samples had an epitaxial relationship at the interface between the Mn-Ir layer and the Ni-Fe layer due to the generation of misfit dislocation.