No abstract

Electromagnetic compatibility (EMC) of integrated circuits (IC) should be within the desirable level for maintaining the functional safety and reliability of electronic systems in different complex automotive and aeronautical applications. Throughout the operational lifetime of ICs, harsh environmental conditions including extreme high or low temperature, humidity, shock, and stress tend to cause intrinsic physical degradations, which results in significant variations of long-life EMC performance of IC device. Consequently, ensuring along with maintaining electromagnetic robustness (EMR) and integrating IC reliability throughout their whole lifetime period is a key challenge that needs to be addressed. The purpose of this paper is to conduct a comprehensive state-of-the-art study on developing accurate immunity and emission models of ICs focusing on quantitative evaluation of experimental characterization based on various IC EMC measurement methods under various ageing accelerated life tests. Producing accurate transient EMC models help not only estimate EMC immunity and emission levels of ICs but also allows determining different failure types and mechanisms due to radio frequency disturbance when applied to IC model structures. This paper presents a few recent researches on the conducted pulse immunity as well as emission models for ICs based on the IEC standard models, showcasing the electric fast transient (EFT) simulations and measurements applied on different IC pins considering the ageing impact. Previous studies demonstrated the importance of the ageing on the EMC performance of ICs depending on the ageing stress parameters. Future perspective of the current study would involve proposing and implementing predictive reliability model for the IC during its entire lifetime under accelerated life tests.

AcknowledgementWe would like to take this opportunity to express our gratitude and appreciation to Dr. KhalilurRahman for his guidance, relentless help and instructions that he has provided us from the time we have started doing thesis under his supervision through the completion of our undergraduate program. The skills and ideas we have been able to learn from him during our Thesis work have benefited us immensely and will continue to do so throughout our future endeavors. | P a g e AbstractIn industries loading and unloading of heavy loads manually is one of the most imporant task which turns out to be quite difficult, time-consuming and risky for humans.In this modern era robots are being developed for various purposes to accomlish many tasks which seem to be too complex for humans. Benefits of using robots, for industrial purpose have been immense in terms of speed and efficiency of doing required tasks compare to that of humans. The paper illustrates the mechanical design of the industry based automated robot which include: Ackerman Steering Mechanism and Differential Mechanism.Ackerman Steering allows front two wheels to turn left and right in the track without going out of the track.Differential has been mounted with two back wheels and a DC motor has been used with its controller to start motion of the robot. This industrial robot has got three features and they are: Path-Tracking, Avoiding Collision, Loading and Unloading heavy industrial goods. The autonomous robot is designed to start its movement from a starting position where goods are loaded on it, then follow a path of white line drawn on black surface and unload goods by itself after reaching a destination place. Digital Line Following sensor has been mounted infront of the robot so thar the sensor can detect path by emitting and receiving signals alowing it to move in the pre-defined track having left and right turns while carrying goods from starting position to the destination. Arduino Uno has been used for programming and the required control circuit of the robot has been designed for controlling the robot's movement within the defined path. Relay Switches have been used to control the braking, and actuator movement during left and right movement of the industrial robot. The main aim is to load and unload heavy goods that has been achieved by two large linear actuators for producing required torque and force necessary to unload heavy loads (up to more than 150kg) sideways to the ground safely.Besides, the robot has been built up having the ability to avoid collision with any obstacles that come in its way. Ultrasonic sensor has been attached with the robot to send the signal and detect the presence of any obstacle that may appear in its path and stop momentarily for certain time until the obstacle move away. Building an industrial robot with moderate Speed, good Efficiency for loading and unloading purpose within a short time to ease human suffering has been the main focus of this paper. | P a g e

This paper compares the EMC performance of three different voltage regulator ICs (i.e. UA78L05, L78L05 and MC78L05) developed by three different manufacturers, with similar functionality and pin compatibility, under the influence of low and high temperature stress conditions (i.e., −30 °C and +100 °C). Direct power injection (DPI) was performed on these ICs to analyze the impact of applying thermal stress on the conducted immunity to the injection of harmonic disturbance. The DPI immunity parameters were measured and recorded in real-time for an incident power between −13 and +30 dBm, while the ICs were exposed to low and high environmental stress conditions. It was found that the minimum injected power required to reach the defined failure threshold voltage criterion (+0.20 V) varied over frequency depending on the IC reference. Results demonstrated that the L78L05 IC reference was more immune to harmonic disturbance up to around 100 MHz compared to other identical IC references under nominal conditions, but its susceptibility to the EM interference increased above 600 MHz. Moreover, these functionally identical ICs showed significant evolution of their conducted immunity at all considered temperatures, depending on their manufacturer. The outcome of the DPI characterization on these IC references at both low and high thermal stress conditions irrespective of their manufacturers of clearly showed that the DPI immunity improves significantly with increasing frequency compared to that of nominal temperature, with little dispersion on minimum injected power needed to observe failure above 700 MHz. Input impedance curves were plotted at low, high and nominal temperature showed noticeable decline at high frequency, which could also explain the combined impact of temperature and obsolescence on the EMC performance of ICs selected from different manufacturers. Consequently, the equivalent RLC values of the lumped elements (i.e., resistor, inductor and capacitor) were extracted and compared at these aforementioned temperature conditions to model the power supply network impedance for the selected IC references. The immunity behaviour of these ICs were further investigated by generating look up table data from the DPI measurements at nominal temperature.