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Wetting and spreading phenomena between SiO 2 single crystal and CaO-SiO 2 slags with difference composition; SiO 2 saturated and non-saturated slags at 1 600°C were investigated by using the dispensed drop technique (DDT) with a high-speed camera (1 000 frames/s). The apparent contact angle and height of non-saturated slag were significantly smaller than those of saturated slag. The apparent radii of saturated and non-saturated slags were significantly different after 0.01 s. The change in the apparent volume of the slags was analyzed by using a spherical cap model. The apparent volume of the saturated slag was constant, but that of the non-saturated slag decreased because of film type spreading. After quenching, the film type spreading was verified, and a dissolution reaction occurred in the non-saturated slag, whereas no such phenomena were observed in the saturated slag. For the saturated slag, the spreading kinetics fit well with the non-reactive viscous model suggested by a previous study. However, nonsaturated slag could not be applied to spreading kinetics due to the film type spreading.

The growth behavior of nanocrystalline diamond (NCD) film has been studied for three different substrates, i.e. bare Si wafer, 1 µm thick W and Ti films deposited on Si wafer by DC sputter. The surface roughness values of the substrates measured by AFM were Si < W < Ti. After ultrasonic seeding treatment using nanometer sized diamond powder, surface roughness remained as Si < W < Ti. The contact angles of the substrates were Si (56During deposition in the microwave plasma CVD system, NCD particles were formed and evolved to film. For the first 0.5h, the values of NCD particle density were measured as Si < W < Ti. Since the energy barrier for heterogeneous nucleation is proportional to the contact angle of the substrate, the initial nucleus or particle densities are believed to be Si < W < Ti. Meanwhile, the NCD growth rate up to 2 h was W > Si > Ti. In the case of W substrate, NCD particles were coalesced and evolved to the film in the short time of 0.5 h, which could be attributed to the fact that the diffusion of carbon species on W substrate was fast. The slower diffusion of carbon on Si substrate is believed to be the reason for slower film growth than on W substrate. The surface of Ti substrate was observed as a vertically aligned needle shape. The NCD particle formed on the top of a Ti needle should be coalesced with the particle on the nearby needle by carbon diffusion. In this case, the diffusion length is longer than that of Si or W substrate which shows a relatively flat surface. This results in a slow growth rate of NCD on Ti substrate. As deposition time is prolonged, NCD particles grow with carbon species attached from the plasma and coalesce with nearby particles, leaving many voids in NCD/Ti interface. The low adhesion of NCD films on Ti substrate is related to the void structure of NCD/Ti interface.