and Conclusions TMSDEA gives consistently higher contact angles than HMDS on substrates typically encountered in IC processing. The effect of water drop contact angle on resist adhesion is demonstrated. A solution of 0.5% vol TMSDEA in HMDS, used at a 50C hotplate temperature, was found to be optimum for a Tokyo Electron Laboratory Mk-V track vapor prime process. Observations made with three reticle levels on bare silicon do not show any exposure dose or resist profile differences between TMSDEA and HMDS vapor primed wafers.