Natural bentonite mineral, without any wet chemical treatment, was used directly to catalyze the growth of multi-wall CNTs and the produced CNTs/bentonite as an integrated composite stably catalyzed the oxidative dehydrogenation reaction over a long period of time; this concept provides a highly economical way for large-scale synthesis of nanocarbons and manufacture of styrene synthesis catalysts.

The Cu x SiBEA zeolites prepared by a two-step postsynthesis method are active in selective catalytic reduction of NO by ethanol and their catalytic activity is related to the presence of mononuclear Cu(II) species. Zeolite with isolated lattice mononuclear Cu(II) species is active in this reaction with selectivity toward dinitrogen close to 70-90%.

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Base metal promoted gold/titania catalysts were synthesized, characterized and tested in CO oxidation reaction. Catalysts containing dopant metals in higher oxidation states exhibited higher activity than catalysts containing dopants in reduced states. The activity of fresh catalysts promoted by Cu, Fe and Ni was similar to the unpromoted one, but treatment in reducing and oxidizing atmospheres revealed the supremacy of the copper promoted catalyst. The sequential deposition method proved to be better than the co-deposition-precipitation method. An attempt to explain these differences using XPS, FTIR and H 2 TPR was performed.

Copper oxides have some interesting photocatalytic properties and reasonably low price which makes them applicable as PN transistors. However, to obtain the best performance it is necessary to increase the specific working surface of materials which plays a key role in many applications. Furthermore, by ordered spacing and heterojunction formation it is possible to fabricate the systems with specific dedicated properties, like for example PN photovoltaic junction. The conducted research analyses the mechanical properties, stress distributions, and thermal stability of metal–oxide structures with such advanced geometries. Micro-perforation of thin Cu sheet was selected for the study, as it can both enhance the free surface of the substrate and decrease the number of sites of thermal stress occurrence. Both Cu-Cu2O and Cu-CuO layers were simulated using finite element analysis. The model based on fixed geometry of square shaped samples of dimensions of 156 × 156 mm was applied to thin metal plates holes-patterned covered on top by 1-3 μm thick oxide layers. On the other hand, the influence of plate thickness was found to be important in terms of structure durability. A good agreement between the simulation and the experimental data was achieved. The critical delamination temperature of c.a. 473-483 K was estimated for both oxide layers. The verification of the simulation/computation model was done by analyzing perforated and non-perforated Cu Electrolytic Tough Pitch (ETP) sheets. Two methods, FIB-TEM and surface scan using a profilometer, were selected. The first verified the decohesion of the oxide coatings from the metal support after exceeding the temperature of 523 K The issue that was also noticed is the susceptibility for peeling in the inner surface of the holes.