Solidification of the aluminum alloys takes place in heat-resistant refractory materials made of either metal or oxides that are stable at high temperatures. The significantly different thermal conductivities between metals and heat-resistant oxides cause solidification with significantly different cooling rates. In this work, we formed a secondary Al-8wt%Si-3wt%Cu alloy in a stainless steel mould, a thin-walled stainless steel cup, and a thick-walled zirconium oxide cup. The course of the formation of the solidified structure was monitored by immersed thermocouples, which enabled the computer analysis of the cooling curves. The parameters on which the cooling rate had the most significant influence are the undercooling values of the formation of primary aluminum crystals, the time of the growth of primary aluminum crystals and the total solidification time from the formation of the first solid crystals to the formation of a fully solidified structure. The Al-8wt%Si-3wt%Cu aluminum alloy formed in metal mould has a smaller grain size and consequently higher tensile strength, lower macro-porosity and less rough surface than the alloy formed in refractory oxide coatings. The examined heat-resistant refractory material influenced the formation of three basic micro-constituents in the Al-8wt%Si-3wt%Cu alloy in different time intervals, which led to the formation of a different microstructure, where the decision on the choice of material for the heat-resistant refractory material depends on the profitability of the entire process, the required quality of the external surfaces and required minimum strength of the final product.