Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interface materials with high thermal conductivity. Here, current developments and challenges in the application of nanotubes as fillers in polymer matrices are explored. The blending together of nanotubes and polymers result in what are known as nanocomposites. Among the most pressing current issues related to nanocomposite fabrication are (i) dispersion of carbon nanotubes in the polymer host, (ii) carbon nanotube-polymer interaction and the nature of the interface, and (iii) alignment of carbon nanotubes in a polymer matrix. These issues are believed to be directly related to the electrical and thermal performance of nanocomposites. The recent progress in the fabrication of nanocomposites with carbon nanotubes as fillers and their potential application in electronics packaging as thermal interface materials is also reported.

Nanocomposites were fabricated by using a commercial two part epoxy as a matrix and multiwalled carbon nanotubes, graphite fibers and boron nitride platelets as filler materials. Multiwalled carbon nanotubes (MWCNTs) that were produced by chemical vapor deposition were found to produce nanocomposites with better thermal diffusivity and thermal conductivity than the MWCNTs that were produced by the combustion method. Compared to the MWCNTs produced by both methods and graphite fibers, boron nitride produced nanocomposites with the highest thermal conductivity. Specific heat capacity was measured by using differential scanning calorimetry and thermal diffusivity was measured by using the laser flash.

No abstract

Aligned polyaniline nanorods were synthesized in the presence of salicylic acid. Nanorods and nanotubes were also formed in the presence of camphorsulfonic acid (CSA) and para-toluenesulfonic acid (pTSA). Electrical conductivity measurements showed that the aligned nanorods had better electrical conductivity than the non-aligned nanostructures. Nanospheres were also observed in some cases. The formation of elongated nanostructures or spheres depended on the aniline monomer to surfactant molar ratio. This method in which nanostructures are formed using soft templates is often referred to as the template-free approach. Our success motivated us to explore the feasibility of obtaining similar metallic nanostructures without the use of a template. We successfully synthesized copper and copper hydroxide nanowires. While the copper nanowires formed as a mesh, the copper hydroxide nanowires formed as winding bundles. Upon switching the order in which the reactants were added, copper hydroxide nanoribbons were formed instead of bundles. Characterization of these nanostructures was done using Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Fourier Transform Infrared Spectroscopy (FTIR) and the Four-point probe to measure electrical conductivity. Both metallic and organic nanowires that are fabricated by template-free methods are potential candidates for use as fillers in polymer nanocomposites. Polymer nanocomposites are found to be used in many advanced modern applications such as thermal interface materials in electronic devices which continue to be miniaturized, aerospace engineering where lightweight and robustness are important, sensors, medicine and catalytic activity.

Nanocomposites of gold nanoparticles (AuNPs) embedded in polyaniline fibers have been fabricated using a one-pot synthesis approach and in-situ polymerization. By using a combination of inorganic acids (e.g. HCl) and camphorsulfonic acid, polyaniline nanostructured fibers of high aspect ratio with diameters of 150 ± 50 nm and several micrometers in length were obtained. These fibers afforded high electrical conductivity of 4.2 ± 0.5 S/cm. Encapsulation of the AuNPs in the polyaniline fibers afforded nanocomposites with high electrical conductivity and dielectric constant of 34.0 ± 0.5 S/cm and 65.3 ± 5 respectively. The morphology of these materials was analyzed using SEM and HRTEM and electronic properties were analyzed using UV-Vis spectroscopy.