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Quality inspection of surface mount capacitor is an offline process and usually done by inspecting some capacitors in a lot using compound microscopes. We propose to use location M estimator with any edge detection methods to inspect the basic dimensions of multi-layer ceramic chip capacitors (MLCC) like width, length, separation distance between two end terminations and the local deviations on the termination boundaries. Usually the distances are calculated by an average distance. The average operator is not robust to outliers in the data. In this paper, we propose to use the combination of location M estimator with any type of edge detection technique which will remove the need of a specific optimal edge detection technique and thus can result into easy hardware realization to inspect the basic dimensions of MLCC.

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