Soft x-ray emission and absorption spectroscopy of the O K-edge are employed to investigate the electronic structure of wurtzite ZnO(0001). A quasiparticle band structure calculated within the GW approximation agrees well with the data, most notably with the energetic location of the Zn 3d -O 2p hybridized state and the anisotropy of the absorption spectra. Dispersion in the band structure is mapped using the coherent k-selective part of the resonant x-ray emission spectra. We show that a more extensive mapping of the bands is possible in the case of crystalline anisotropy such as that found in ZnO.

The advantages and disadvantages of using off-axis substrates for heteroepitaxial growth of 3C-SiC on Si(111) substrates are investigated in this paper. 3C-SiC is deposited on on-axis and 4° off-axis 150 mm Si(111) substrates using low pressure chemical vapour deposition. The dependence of surface morphology, roughness, crystallinity, alignment between the epilayer and the substrate, and film stress are evaluated using atomic force microscopy, x-ray diffraction, and wafer curvature measurement. Highly parallel steps are observed on both on-axis and off-axis Si substrates after surface preparation, yet step density is doubled and step height is much larger (> 21 times of single step height) for 4° off-cut Si compared to on-axis Si. X-ray diffraction results indicate that SiC grown on on-axis Si substrates are well-aligned with the Si substrates, while the SiC grown on off-axis substrates are tilted positively by as large angle as 1.66°. The well-aligned SiC grown on on-axis Si substrate exhibits lower and uniform residual stress compared to the film grown on off-axis Si substrates, which exhibits a nonuniform distribution of higher stress.The stress distribution is found to be dependent on Si surface step direction and height. These misorientation dependent tilting and stress distribution mechanisms are expected to be applicable to other hetero-epitaxial growth systems with similar mismatch magnitude.

Extreme electron accumulation with sheet density greater than 10(13) cm(-2) is almost universally present at the surface of indium nitride (InN). Here, x-ray photoemission spectroscopy and secondary ion mass spectrometry are used to show that the surface Fermi level decreases as the Mg concentration increases, with the sheet electron density falling to below 10(8) cm(-2). Surface space-charge calculations indicate that the lowering of the surface Fermi level increases the density of unoccupied donor-type surface states and that these are largely compensated by Mg acceptors in the near-surface hole depletion region rather than by accumulated electrons. This is a significant step towards the realization of InN-based optoelectronic devices.

Single-crystal silicon carbide (SiC) thin-films on silicon (Si) were used for the fabrication and characterization of electrically conductive distributed Bragg reflectors (DBRs) on 100 mm Si wafers. The DBRs, each composed of 3 alternating layers of SiC and Al(Ga)N grown on Si substrates, show high wafer uniformity with a typical maximum reflectance of 54% in the blue spectrum and a stopband (at 80% maximum reflectance) as large as 100 nm. Furthermore, high vertical electrical conduction is also demonstrated resulting to a density of current exceeding 70 A/cm2 above 1.5 V. Such SiC/III-N DBRs with high thermal and electrical conductivities could be used as pseudo-substrate to enhance the efficiency of SiC-based and GaN-based optoelectronic devices on large Si wafers.