Electron-beam lithography (EBL) is an important technique in manufacturing high-resolution nanopatterns for broad applications. However, the proximity effect in EBL can degrade the pattern quality and, thus, impact the performance of the applications greatly. The conventional proximity effect correction (PEC) methods, which employ computationally intensive cell or path removal method for development simulation, are very computational lengthy, especially for complex and large-area patterns. Here, the authors propose a novel short-range PEC method by transforming the evaluation of pattern feasibility into the shortest path problem based on the concept of critical-development time. The authors combine this evaluation algorithm with the swarm intelligence which mimics the natural collective behavior of animals to optimize the design of electron dose distribution in EBL. The PEC algorithm is applied for pattern fabrication for U-shaped split-ring resonator and produces optimized exposure pattern that shows excellent agreement with the targeted objectives. Our work on the PEC strategy reduces the computational cost significantly and is particularly suitable for the design of complex pattern with various constraints.

In this study, we propose a set of single-spot experiment to construct a comprehensive model of electron-beam lithography to describe the relation among the incident electrons, resist, and the development conditions such as durations and temperatures. Through the experiments, small feature can be achieved by performing a short-time development due to the high acceleration voltage and large depth of focus of electron-beam system. The singular point in the beginning of the development is also observed in our model and supported by the experimental data. In addition, we verify the characteristic region of each incident spot induced by the point spread function of the electron-beam system. We further fabricate the single line with narrow groove width by utilizing the results from single-spot experiment at low developing temperatures. The line is formed by arranging a series of incident points with a distance close to the characteristic radius. This method can eliminate the proximity effect effectively and thus the groove width is scaled down to 8 nm. By adopting the successful experience in the single line formation, dense array with narrow linewidth is also demonstrated under well suppression of the proximity effect. The minimum groove width of 9 nm with 30 nm pitch is achieved with 5 s development time at -10 °C. Finally, the exceptional capability of pattern transfer is presented due to the high aspect ratio of the resist.