To solve the problems of high contact resistance of silver nanowires (AgNWs) conductive ink, low silver content of particle-free silver conductive ink, we prepared a mixed ink, composed of AgNWs conductive ink and particle-free silver conductive ink. Mixed conductive film and AgNWs conductive film are obtained by mask printing method. Compared with AgNWs conductive film，the conductive film sintered at 100 °C exhibits good electrical properties with a resistivity of 4.80×10-5 Ω·cm, which is 14.8 % of AgNWs conductive film (32.37×10-5 Ω·cm). Sintered at 60 ℃, the resistivity of the mixed conductive film is 12.5% of AgNWs conductive film. The mixed conductive film has a porosity of 7.74%, which is 20.7% lower than that of the AgNWs conductive film. The bridging effect of in-situ silver nanoparticles (AgNPs) allows the connection between AgNWs to be firmer and more compact, which reduces the contact resistance and achieves better conductivity.