n-ZnO/p-Si heterojunction light-emitting diodes ͑LEDs͒ show weak defect-related electroluminescence ͑EL͒. In order to analyze the origin of the weak EL, the energy band alignment and interfacial microstructure of ZnO/Si heterojunction are investigated by x-ray photoelectron spectroscopy. The valence band offset ͑VBO͒ is determined to be 3.15Ϯ 0.15 eV and conduction band offset is −0.90Ϯ 0.15 eV, showing a type-II band alignment. The higher VBO means a high potential barrier for holes injected from Si into ZnO, and hence, charge carrier recombination takes place mainly on the Si side rather than the ZnO layer. It is also found that a 2.1 nm thick SiO x interfacial layer is formed at the ZnO/Si interface. The unavoidable SiO x interfacial layer provides to a large number of nonradiative centers at the ZnO/Si interface and gives rise to poor crystallinity in the ZnO films. The weak EL from the n-ZnO/p-Si LEDs can be ascribed to the high ZnO/Si VBO and existence of the SiO x interfacial layer.

Thin SiO2 interlayer is the key to improving the electroluminescence characteristics of light emitting diodes based on ZnO heterojunctions, but little is known of the band offsets of SiO2/ZnO. In this letter, energy band alignment of SiO2/ZnO interface was determined by x-ray photoelectron spectroscopy. The valence band offset ΔEV of SiO2/ZnO interface is determined to be 0.93±0.15 eV. According to the relationship between the conduction band offset ΔEC and the valence band offset ΔEV: ΔEC=EgSiO2−EgZnO−ΔEV, and taking the room-temperature band-gaps of 9.0 and 3.37 eV for SiO2 and ZnO, respectively, a type-I band-energy alignment of SiO2/ZnO interface with a conduction band offset of 4.70±0.15 eV is found. The accurate determination of energy band alignment of SiO2/ZnO is helpful for designing of SiO2/ZnO hybrid devices and is also important for understanding their carrier transport properties.

Ta2O5/TaOx heterostructure has become a leading oxide layer in memory cells and/or a bidirectional selector for resistive random access memory (RRAM). Although atomic layer deposition (ALD) was found to be uniquely suitable for depositing uniform and conformal films on complex topographies, it is hard to use ALD to grow suboxide TaOx layer. In this study, tantalum oxide films with a composition of Ta2O5 were grown by ALD. Using Ar+ ion irradiation, the suboxide was formed in the top layer of Ta2O5 films by observing the Ta core level shift toward lower binding energy with angle-resolved X-ray photoelectron spectroscopy. By controlling the energy and irradiation time of an Ar+ ion beam, Ta2O5/TaOx heterostructure can be reliably produced on ALD films, which provides a way to fabricate the critical switching layers of RRAM.

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