In this paper, a series of Al/Ti multilayers with different modulation periods were used in copper and Al 2 O 3 ceramic diffusion bonding. The reactive multilayer was deposited by DC magnetron sputtering, and the diffusion bonding experiments were performed at 900 C for 10 min with a pressure of 5 MPa. The interfacial joints were inspected by scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction and tensile shear tests. As a result, no signi cant metallurgical defect was observed in the microstructures of the joints. The formation of several intermetallic compounds at the interface, such as Cu/Ti eutectic and Al 2 O 3-X ·TiO compound, has further con rmed the success of Cu-Al 2 O 3 bonding as compared to the Al/Ni nano-multilayers, which use Al/Ti nano-foils as interlayer for diffusion bonding to bring more bene t to the quality of cermet joint.

The paper examines the joinability, microstructures and thermal behaviors of the AlNi nano multilayers. The results reveal the transitions and possible compositions of the nano multilayers when heating. Nanoscale AlNi multilayers could be used in CuCu diffusion joining though the process and preparation method need to be optimized.