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Sn-58Bi eutectic solder ribbon was successfully prepared using an improved single-roller rapid solidification device with the optimum process parameters. The microstructure, melting behavior and wettability of Sn-58Bi eutectic solder ribbon prepared by rapid solidification technology (RST) and conventional casting-rolling process (CRP) respectively were investigated by optical microscopy (OM), differential scanning calorimetry (DSC) and wettability tests. The results show that the forming effect of solder ribbons can be obviously improved by mainly optimizing roller line speed, nozzle-to-roller spacing and heating temperature. Sn-58Bi eutectic solder ribbon prepared by RST has finer microstructure, lower solidus temperature and more excellent wettability than that of the ribbon prepared by CRP. Therefore, the study of Sn-58Bi eutectic solder ribbon is conducive to cut cost, meet growing performance requirements, and reduce lead contamination for electronic package industry.

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