In this study, we propose high-performance chitosan-based flexible memristors with embedded single-walled carbon nanotubes (SWCNTs) for neuromorphic electronics. These flexible transparent memristors were applied to a polyethylene naphthalate (PEN) substrate using low-temperature solution processing. The chitosan-based flexible memristors have a bipolar resistive switching (BRS) behavior due to the cation-based electrochemical reaction between a polymeric chitosan electrolyte and mobile ions. The effect of SWCNT addition on the BRS characteristics was analyzed. It was observed that the embedded SWCNTs absorb more metal ions and trigger the conductive filament in the chitosan electrolyte, resulting in a more stable and wider BRS window compared to the device with no SWCNTs. The memory window of the chitosan nanocomposite memristors with SWCNTs was 14.98, which was approximately double that of devices without SWCNTs (6.39). Furthermore, the proposed SWCNT-embedded chitosan-based memristors had memristive properties, such as short-term and long-term plasticity via paired-pulse facilitation and spike-timing-dependent plasticity, respectively. In addition, the conductivity modulation was evaluated with 300 synaptic pulses. These findings suggest that memristors featuring SWCNT-embedded chitosan are a promising building block for future artificial synaptic electronics applications.

In this study, the efficient fabrication of nickel silicide (NiSix) Schottky barrier thin-film transistors (SB-TFTs) via microwave annealing (MWA) technology is proposed, and complementary metal-oxide-semiconductor (CMOS) inverters are implemented in a simplified process using ambipolar transistor properties. To validate the efficacy of the NiSix formation process by MWA, NiSix is also prepared via the conventional rapid thermal annealing (RTA) process. The Rs of the MWA NiSix decreases with increasing microwave power, and becomes saturated at 600 W, thus showing lower resistance than the 500 °C RTA NiSix. Further, SB-diodes formed on n-type and p-type bulk silicon are found to have optimal rectification characteristics at 600 W microwave power, and exhibit superior characteristics to the RTA SB-diodes. Evaluation of the electrical properties of NiSix SB-TFTs on excimer-laser-annealed (ELA) poly-Si substrates indicates that the MWA NiSix junction exhibits better ambipolar operation and transistor performance, along with improved stability. Furthermore, CMOS inverters, constructed using the ambipolar SB-TFTs, exhibit better voltage transfer characteristics, voltage gains, and dynamic inverting behavior by incorporating the MWA NiSix source-and-drain (S/D) junctions. Therefore, MWA is an effective process for silicide formation, and ambipolar SB-TFTs using MWA NiSix junctions provide a promising future for CMOS technology.

In this study, a high-performance bio-organic memristor with a crossbar array structure using milk as a resistive switching layer (RSL) is proposed. To ensure compatibility with the complementary metal oxide semiconductor process of milk RSL, a high-k Ta2O5 layer was deposited as a capping layer; this layer enables high-density, integration-capable, photolithography processes. The fabricated crossbar array memristors contain milk–Ta2O5 hybrid membranes, and they exhibit bipolar resistance switching behavior and uniform resistance distribution across hundreds of repeated test cycles. In terms of the artificial synaptic behavior and synaptic weight changes, milk–Ta2O5 hybrid crossbar array memristors have a stable analog RESET process, and the memristors are highly responsive to presynaptic stimulation via paired-pulse facilitation excitatory post-synaptic current. Moreover, spike-timing-dependent plasticity and potentiation and depression behaviors, which closely emulate long-term plasticity and modulate synaptic weights, were evaluated. Finally, an artificial neural network was designed and trained to recognize the pattern of the Modified National Institute of Standards and Technology (MNIST) digits to evaluate the capability of the neuromorphic computing system. Consequently, a high recognition rate of over 88% was achieved. Thus, the milk–Ta2O5 hybrid crossbar array memristor is a promising electronic platform for in-memory computing systems.

In this study, we propose the fabrication of sol-gel composite-based flexible and transparent synaptic transistors on polyimide (PI) substrates. Because a low thermal budget process is essential for the implementation of high-performance synaptic transistors on flexible PI substrates, microwave annealing (MWA) as a heat treatment process suitable for thermally vulnerable substrates was employed and compared to conventional thermal annealing (CTA). In addition, a solution-processed wide-bandgap amorphous In-Ga-Zn (2:1:1) oxide (a-IGZO) channel, an organic polymer chitosan electrolyte-based electric double layer (EDL), and a high-k Ta2O5 thin-film dielectric layer were applied to achieve high flexibility and transparency. The essential synaptic plasticity of the flexible and transparent synaptic transistors fabricated with the MWA process was demonstrated by single spike, paired-pulse facilitation, multi-spike facilitation excitatory post-synaptic current (EPSC), and three-cycle evaluation of potentiation and depression behaviors. Furthermore, we verified the mechanical robustness of the fabricated device through repeated bending tests and demonstrated that the electrical properties were stably maintained. As a result, the proposed sol-gel composite-based synaptic transistors are expected to serve as transparent and flexible intelligent electronic devices capable of stable neural operation.

Herein, high‐performance solution‐processed amorphous indium–gallium–zinc–oxide (a‐IGZO) thin‐film transistors (TFTs) with low trap densities due to post‐deposition annealing (PDA) are processed with a low‐thermal‐budget microwave (MW) heat treatment. To verify the MW effectiveness, the composition ratio of a‐IGZO thin films and the electrical characteristics of TFTs prepared by conventional thermal annealing (CTA) are compared. An X‐ray photoelectron spectroscopy (XPS) analysis reveals that MW annealing (MWA) improves the film quality more effectively than CTA. a‐IGZO TFTs treated by MWA or CTA are fabricated to evaluate their electrical characteristics. MWA is more effective than CTA in improving the performance, such as hysteresis, subthreshold swing (SS), field effect mobility (μ FE), and on/off current ratio (I on/I off). MWA provides lower interfacial trap density (D it) and volume trap density (N t) than CTA. To evaluate instability, the threshold voltage (V TH) shift is monitored using positive and negative gate‐bias stress tests. MWA demonstrates better reliability than CTA. In conclusion, high‐performance solution‐based a‐IGZO TFTs can be implemented by lowering the charge traps in the a‐IGZO channel using MWA.