In order to simplify the array manufacturing process of FFS TFT-LCD, novel four-mask process which is adopted to the optimum multiple-slit design in the common electrode and contact hole has been developed. The adoption of the optimum multiple-slit design is able to support stable process margin without ripple of graytone. Moreover, continuous process by etching of the gate and transparent common electrode simplify array process of FFS devices.

The unstable contact between probe-pins and indium zinc oxide (IZO) films is a hindrance to the adoption of IZO in mass production. This is primarily caused by the contamination of the IZO surface by OH-. It is a suitable solution for this problem to apply high voltage pulses on signal pad before an array test