Gallium nitride (GaN) is a compound semiconductor that has tremendous potential to facilitate economic growth in a semiconductor industry that is silicon-based and currently faced with diminishing returns of performance versus cost of investment. At a material level, its high electric field strength and electron mobility have already shown tremendous potential for high frequency communications and photonic applications. Advances in growth on commercially viable large area substrates are now at the point where power conversion applications of GaN are at the cusp of commercialisation. The future for building on the work described here in ways driven by specific challenges emerging from entirely new markets and applications is very exciting. This collection of GaN technology developments is therefore not itself a road map but a valuable collection of global state-of-the-art GaN research that will inform the next phase of the technology as market driven requirements evolve. First generation production devices are igniting large new markets and applications that can only be achieved using the advantages of higher speed, low specific resistivity and low saturation switching transistors. Major investments are being made by industrial companies in a wide variety of markets exploring the use of the technology in new circuit topologies, packaging solutions and system architectures that are required to achieve and optimise the system advantages offered by GaN transistors. It is this momentum that will drive priorities for the next stages of device research gathered here.

Multiple quantum well (MQW) InGaN light emitting diodes with and without electron blocking layers, with relatively small and large barriers, with and without p-type doping in the MQW region emitting at ∼420nm were used to determine the genesis of efficiency droop observed at injection levels of approximately ⩾50A∕cm2. Pulsed electroluminescence measurements, to avoid heating effects, revealed that the efficiency peak occurs at ∼900A∕cm2 current density for the Mg-doped barrier, near 550A∕cm2 for the lightly doped n-GaN injection layer, meant to bring the electron injection level closer to that of holes, and below 220A∕cm2 for the undoped InGaN barrier cases. For samples with GaN barriers (larger band discontinuity) or without p-AlGaN electron blocking layers the droop occurred at much lower current densities (⩽110A∕cm2). In contrast, photoluminescence measurements revealed no efficiency droop for optical carrier generation rates corresponding to the maximum current density employed in pulsed injection measurements. All the data are consistent with heavy effective mass of holes, low hole injection efficiency (due to relatively lower p-doping) leading to severe electron leakage being responsible for efficiency droop.

Single crystal AlN provides a native substrate for Al-rich AlGaN that is needed for the development of efficient deep ultraviolet light emitting and laser diodes. An absorption band centered around 4.7 eV (∼265 nm) with an absorption coefficient above 1000 cm−1 is observed in these substrates. Based on density functional theory calculations, substitutional carbon on the nitrogen site introduces absorption at this energy. A series of single crystalline wafers were used to demonstrate that this absorption band linearly increased with carbon, strongly supporting the model that CN- is the predominant state for carbon in AlN.

The internal quantum efficiency (IQE) of Al0.55Ga0.45N/AlN and Al0.55Ga0.45N/Al0.85Ga0.15N UVC MQW structures was analyzed. The use of bulk AlN substrates enabled us to undoubtedly distinguish the effect of growth conditions, such as V/III ratio, on the optical quality of AlGaN based MQWs from the influence of dislocations. At a high V/III ratio, a record high IQE of ∼80% at a carrier density of 1018 cm−3 was achieved at ∼258 nm. The high IQE was correlated with the decrease of the non-radiative coefficient A and a reduction of midgap defect luminescence, all suggesting that, in addition to dislocations, point defects are another major factor that strongly influences optical quality of AlGaN MQW structures.

The structural and optical quality of a freestanding AlN substrate prepared from a thick AlN layer grown by hydride vapor phase epitaxy (HVPE) on a bulk (0001)AlN substrate prepared by physical vapor transport (PVT) were investigated. The prepared HVPE-AlN substrate was crack- and stress-free. High-resolution X-ray diffraction ω-rocking curves of symmetric (0002) and skew-symmetric (1011) reflections had small full widths at half maximum (FWHMs) of 31 and 32 arcsec, respectively. Deep-ultraviolet optical transparency of the HVPE-AlN substrate was higher than that of the PVT-AlN substrate, which was related to lower concentrations of C, O impurities, and Al vacancy.