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The mobility of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructures changes significantly with Al content in the AlGaN barrier layer, while few mechanism analyses focus on it. Theoretical calculation and analysis of the 2DEG mobility in AlGaN/GaN heterostructures with varied Al content are carried out based on the recently reported experimental data. The 2DEG mobility is modeled analytically as the total effects of the scattering mechanisms including acoustic deformation-potential, piezoelectric, polar optic phonon, alloy disorder, interface roughness, dislocation and remote modulation doping scattering. We show that the increase of the 2DEG density, caused by the ascension of the Al content in the barrier layer, is a dominant factor that leads to the changes of the individual scattering processes. The change of the 2DEG mobility with Al content are mainly determined by the interface roughness scattering and the alloy disorder scattering at 77 K, and the polar optic phonon scattering and the interface roughness scattering at the room temperature. The calculated function of the interface roughness parameters on the Al content shows that the stress caused AlGaN/GaN interface degradation at higher Al content is an important factor in the limitation of the interface roughness scattering on the 2DEG mobility in AlGaN/GaN heterostructures with high Al content.

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Citation: Yue Y Z, Hao Y, Feng Q, et al. Study of GaN MOS-HEMT using ultrathin Al 2 O 3 dielectric grown by atomic layer deposition.We report on a GaN metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) using atomic-layer deposited (ALD) Al 2 O 3 as the gate dielectric. Through further decreasing the thickness of the gate oxide to 3.5 nm and optimizing the device fabrication process，a device with maximum transconductance of 150 mS/mm was produced. The drain current of this 0.8 μm gate-length MOS-HEMT could reach 800 mA/mm at +3.0 V gate bias. Compared to a conventional AlGaN/GaN HEMT of similar design, better interface property, lower leakage current, and smaller capacitance-voltage (C-V) hysteresis were obtained, and the superiority of this MOS-HEMT device structure with ALD Al 2 O 3 gate dielectric was exhibited.