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This paper proposes a low-in-plane damage ZPI (Z-pin pre-hole insertion) process. The delamination growth behavior and the influence of Z-pin insertion density on the mode I interlaminar fracture toughness of laminate was explored experimentally and numerically. Meanwhile, Z-pin pull-out and shear tests were conducted in order to provide accurate data for the DCB simulation test. What’s more, an infinite-focus microscope was used to scan the specimen’s defect caused by the ZPI process. It can be found that the ZPI process can lead to less Z-pin inclination, fibre breaking, and crack initiation at the bonded interface. The DCB test results show that the load-displacement curve can be distinguished into four stages for the pinned specimen. In addition, a specimen pinned with a higher Z-pin volume fraction to more suitable for increasing the G IC. The simulation results show that the simulated maximum load and the G IC of the specimen are 286.63 N and 940.06 J·m−2, with a 0.56% and 10.10% error from the experimental result, indicating that the proposed FE model is validated by comparing the predictions with the experimental results. These results can provide some guidance for fabricating the reinforced laminates via the ZPI process.