Studies related to facial soft tissue thickness (FSTT) have been conducted since the late 19th century. Soft tissue is any tissue in the body that is not hardened by ossification or calcification processes, such as bones and teeth; and varies according to sex, age, race, and nutritional status. Forensically, soft tissue thickness plays an important role in cases where a cadaver has no unique characteristics; and the remains cannot be identified through DNA analysis, fingerprints, or examination of dental records. Therefore, the results of the current study suggest that the average thickness of the three skeletal classes (i.e., straight, concave, and convex) should be used for face restoration and forensic art research. It is thought that the current study’s results will be invaluable in the fields of forensic science, forensic art, anthropology, and dentistry. As a result, gender differences were observed in all classes, and the facial tissue thickness in Korean adults differed according to gender and occlusion type.

Capillary electrophoresis (CE) is found to be suitable for determining the concentration of inorganic ions in the copper and gold plating solutions used in the semiconductor manufacturing process. Tris(hydroxymethyl) aminomethane (Tris buffer) with added pyridine dicarboxylic acid (PDC) allows the simultaneous detection of sulfate and copper ions, and adding chromate allows the separation of Cl − from the sulfate matrix. When the methods developed are applied to process chemicals, the new analytical technique agrees well with that of current standard techniques within 99.5% (±0.99). The detection limits of these inorganic ions ranged from 0.99 to 2.32 μg/mL, with relative standard deviations (n = 4) ranging from 0.38% to 10.3%. A method to separate sulfite from sulfate was also developed for gold plating solutions. The optimized method successfully permits determination of sulfite and sulfate with concentrations of 4.65% (± 0.43) and 4.32% (± 0.37), respectively. These methods can lower production cost, raise production efficiency, and increase the chemical lifetime in the semiconductor manufacturing process through simplified process control, waste reduction, and recycling.