Cycloaliphatic epoxy resin (3-4-epoxycyclohexane) methyl 3-4-epoxycyclohexylcarboxylate (ECC) was formulated with flexible hydrogenated bisphenol A diglycidyl ether (HBADGE) to inspect the influence of chain flexibility on the performance and reliability of epoxy packaged Light-emitting Diode (LED). The properties of epoxy encapsulants were characterized by using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), thermogravimetric analyses (TGA), ultraviolet visible (UV−Vis) spectrophotometer, thermomechanical analyzer (TMA), scanning acoustic microscopy (SAM), and scanning electron microscopy (SEM). With the incorporation of flexible HBADGE, favorable properties were obtained, such as decreased thermal expansion coefficient (CTE), lowered storage modulus at reflow temperature, and depressed equilibrium water uptake for the epoxy packaging materials.The light transmittance of encapsulants differed after thermal and UV aging. Compared with Neat ECC and Neat HBADGE, the HBADGE-modified encapsulants endowed LED devices with good performance and high reliability.
To study the effect of charge transfer and chain stacking on the optical and thermal properties, a group of polyimides (PIs) were prepared from various diamines and dianhydrides containing sulfone, amide, and/or trifluoromethyl groups. Ultraviolet–visible spectroscopy, thermomechanical analysis, and thermogravimetric analysis were employed to study the properties of PIs. PIs containing sulfone and amide groups exhibited transmittance varying from 2.9% to 44.9% at 400 nm with good thermal stabilities of 5% weight loss in nitrogen at 455–466°C. The coefficient of thermal expansion values were 37.7–49.8 ppm/°C and glass transition temperatures were 261–299°C. The improved optical properties are owing to incorporation of amide group that decreases the electron-acceptability and sulfone group that distorts the chains, inhibiting the dense chain stacking. There is a trade-off relationship between the optical property and thermal property.
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