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Poly(4‐methyl‐1‐pentene) (P4MP) was characterized to evaluate its viability as a high‐temperature dielectric film for capacitors. Detailed investigation of thermal, mechanical, rheological, and dielectric properties was carried out to assess its high‐temperature performance and processability. P4MP was melt‐processable below 270 °C without degradation and application temperatures as high as 160–190 °C can be achieved. The dielectric constant and loss of melt‐processed P4MP films was comparable to biaxially oriented polypropylene (BOPP) capacitor films, although the dielectric strength was lower. Enhancements in dielectric strength up to 250–300% were achieved via solution‐processing P4MP films, which could be easily scaled up on a roll‐to‐roll platform to yield isotropic, free‐standing films as thin as 3–5 μm. The influence of crystal structure, crystallinity, and surface morphology of these films on the dielectric properties was examined. The dielectric strength was further increased by 450% through biaxial stretching of solution‐cast films, and a Weibull breakdown field of 514 V/μm was obtained. The dielectric constant was very stable as a function of frequency and temperature and the dielectric loss was restricted to <1–2%. Overall, these results suggest that BOP4MP is a promising candidate to obtain similar energy density as a BOPP capacitor film but at much higher operating temperatures. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017, 55, 1497–1515

Fundamental studies of potential candidates for DC electric power transmission in high temperature environment, including ETFE, FEP, PTFE, PI and PEEK, are carried out and presented in form of the series papers containing space charge and conduction as part I, partial discharge as part II, and the degradation and surface breakdown as part III. In this part, the space charge at 20kV/mm was measured at 25 °C and with a thermal gradient at 50 °C. The electrical conductivity was measured at electric fields ranging from 10kV/mm to 30kV/mm in temperatures ranging from 25 °C to 200 °C. The experimental results showed that considering the effect of thermal condition and electric field, FEP has the lowest total amount of space charge accumulation and electric field distortion among these materials at the measured conditions. PI and PEEK have the lowest amount of trap-controlled mobility at 25 °C due to deeper average trap level because of the aromatic rings in the structure. PTFE and PI have the lowest amount of thermal activation energy and temperature-dependent electrical conductivity due to the more uniform morphological phase comparing to ETFE, FEP, and PEEK. The outcomes of this paper serve as a benchmark for the fundamental researches over high temperature materials for DC applications and lay a basis for Part II and Part III.

silicone rubber coating applied to insulators in rd located near Long Island Sound has depolymerized and become putty-like after six years of service. Coating samples were taken from high creep insulators which were energized and weathered, weathered but not energized, and neither weathered or energized (warehouse storage). The unweathered and unenergized coating did not appear to degrade. The weathered but unenergized coating had degraded measurably but was still in an operational state. The energized and weathered coating has become putty-line and lost all physical integrity. This suggests aging by a combination of chemical, photochemical (weathering), and electrochemical mechanisms.