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408)55.3-2358, jolu?_lau@~agilent.coiii -Agilcnt Technologies. Inc.. 4.380 Zicglcr Road Forl Collins, CO (970)288-4657. \valter_daukslicragilent.com 'Sandia National Laboratories Albuquerque. NM (505)844-3429, ph%ncc@!sandia.gov ~ Abst ractA set of accclcration niodels for lead-frec solder joints is proposed and discussed in this shidy. Useful equations for the acceleration models, life distribution. and failure m e are also provided. Furthennorc, methods for selecting the acceleration factor are discussed. In addition. non-lincar 3D creep analyscs of the 256-pin plastic ball grid array PCB (printed circuit board) assembly are presented. The solder joints are made of 95.5wt%Sn-j.9wt%Ag-O.~~~tY~u lead-free soldcr. The leadfree results will be coinparcd to those with Sn-Pb solder joints.

Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.

Solder joint reliability of flip chip on various thickness of printed circuit board with imperfect underfill is presented in this study. Emphasis is placed on the determination of the temperature-dependent stress and plastic strain at the corner solder joint with different crack (delamination) lengths. Also, the strain energy release rate and phase angle at the crack tip of the interface between the underfill and solder mask are obtained by fracture mechanics. [S1043-7398(00)01104-X]