X-ray microbeams are an emerging characterization tool with broad implications for science, ranging from materials structure and dynamics, to geophysics and environmental science, to biophysics and protein crystallography. We describe how submicrometer hard x-ray beams with the ability to penetrate tens to hundreds of micrometers into most materials and with the ability to determine local composition, chemistry, and (crystal) structure can characterize buried sample volumes and small samples in their natural or extreme environments. Beams less than 10 nanometers have already been demonstrated, and the practical limit for hard x-ray beam size, the limit to trace-element sensitivity, and the ultimate limitations associated with near-atomic structure determinations are the subject of ongoing research.

Inelastic neutron scattering measurements of individual phonon lifetimes and dispersion at 295 and 1200 K have been used to probe anharmonicity and thermal conductivity in UO2. They show that longitudinal optic phonon modes carry the largest amount of heat, in contrast to past simulations and that the total conductivity demonstrates a quantitative correspondence between microscopic and macroscopic phonon physics. We have further performed first-principles simulations for UO2 showing semiquantitative agreement with phonon lifetimes at 295 K, but larger anharmonicity than measured at 1200 K.

The determination of residual stress by diffraction depends on the correct measurement of the strain-free lattice spacing d 0 hkl , or alternatively the enforcement of some assumption about the state of strain or stress within the body. It often represents the largest uncertainty in residual stress measurements since there are many ways in which the strain-free lattice spacing can vary in ways that are unrelated to stress. Since reducing this uncertainty is critical to improving the reliability of stress measurements, this aspect needs to be addressed, but it is often inadequately considered by experimenters. Many different practical strategies for the determining of d 0 hkl or d ref have been developed, some well known, others less so. These are brought together here and are critically reviewed. In practice, the best method will vary depending on the particular application under consideration. Consequently, situations for which each method are appropriate are identified with reference to practical examples. research papers J. Appl. Cryst. (2007). 40, 891-904 P. J. Withers et al. Obtaining the strain-free lattice parameter 893

This article describes a quantitative study of the microstructure of nickel-based superalloy RR1000 tube structures joined by inertia welding. One as-welded and three post weld heat-treated (PWHT) conditions have been investigated. The samples were characterized mechanically by measuring the hardness profiles and microstructurally in terms of ␥ grain size, ␥ Ј precipitate size and volume fraction, stored energy, and microtexture. Electron backscatter diffraction (EBSD) was used to characterize highangle grain boundaries (HAGB) and the variation of microtexture across the weld line. The coherent ␥ Ј precipitates were investigated over a range of scales on etched samples in a field emission gun scanning electron microscope (FEGSEM), using carbon replicas in a transmission electron microscope (TEM) and from thin slices by means of high-energy synchrotron X-rays. Dramatic changes in the microstructure were observed within 2 mm of the weld line. In this region, the hardness profile is influenced by changes in grain size, ␥ Ј volume fraction, ␥ Ј particle size, and the work stored in the material. Further away, the observed hardness variation is still significant although only minor microstructural changes could be observed. In this region, the correlation of microstructure and hardness is less straightforward. Here, a combination of small microstructural changes appears to give rise to a significant change in strength. No significant texture or grain distortion was observed in the extensively plastically deformed region due to recrystallization.

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