The choice of a self-assembled monolayer (SAM) is tailored to specifically remove water on an indium-tin oxide electrode and to reduce barrier height for long-term stability of polymer light-emitting diodes. Water, which is a major cause of long-term degradation, is shown to have entirely reversible effects on the power efficiency of the device. It is shown that the use of a SAM for the specific purposes results in a more than an order of magnitude increase in the half lifetime of the device based on poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylenevinylene].
A technique is presented for patterning the metal cathode of organic light-emitting diodes that allows for cathode engineering. The technique involves transferring pretreated and prepatterned metal on a substrate onto the surface of organic layers of the device by pressing, utilizing a difference in the adhesion strength of the metal between the substrate and the underlying organic layer. This cathode transfer technique is applied to fabricating a 20ϫ10 passive matrix display with a pixel size of 250 m by 250 m.
Since the scalability of OLED process is crucial factor for TV application, white OLED with color filter has been developed for large-size AMOLED panel. Despite of recent technology advancement enabling high color purity, largesized AMOLED, a lot of problems to solve still exist to enter the large-sized display market. Here, Samsung will discuss what has been concerned for large panel and how far the OLED technologies need to go for the marketplace of largesized display.
A method of transferring a bilayer of polymer capped with metal to a substrate is
developed with a mould that is coated with a metal followed by a polymer. A
self-assembled monolayer chemisorbed on the mould surface plays a key role in the bilayer
transfer. This bilayer reversal imprint lithography offers a distinct advantage
over other imprint techniques in allowing for a high aspect ratio of the pattern
transferred onto a substrate, which has been difficult to obtain for small feature sizes.
The method requires only one etching step as opposed to the two etching steps
typically needed in the imprint lithography, which can degrade the pattern fidelity.
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