Recent studies have demonstrated that copper (I) thiocyanate (CuSCN) has huge potential as a hole extraction material (HEM) for perovskite solar cells. Here, we used CuSCN as a HEM and analyzed its relationships with a methylammonium lead iodide (MAPbI 3 ) perovskite layer. The CuSCN dissolved in diethyl sulfide (DES) was spin-coated on the MAPbI 3 layer. For high-quality and dense CuSCN layers, post-annealing was carried out at various temperatures and times. However, the unwanted dissociation of MAPbI 3 to PbI 2 was observed due to the postannealing for a long time at elevated temperatures. In addition, DES, which is used as a CuSCN solvent, is a polar solvent that damages the surface of MAPbI 3 perovskites and causes poor interfacial properties between the perovskite layer and HEM. To solve this problem, the effect of the molar ratio of methylammonium iodide (MAI) and PbI 2 in the MAPbI 3 precursor solution was investigated. The excess MAI molar ratio in the MAPbI 3 precursor solution reduced MAPbI 3 surface damage despite using DES polar solvent for CuSCN solution. In addition, dissociation of MAPbI 3 to PbI 2 following an adequate post-annealing process was well suppressed. The excess MAI molar ratio in the MAPbI 3 precursor could be compensated for the MA loss and effectively suppress phase separation from MAPbI 3 to MAI + PbI 2 during post-annealing. The efficiency based on the normal planar structure of CuSCN/MAPbI 3 (using excess MAI)/TiO 2 was approximately 17%. The CuSCN-based MAPbI 3 device shows more optimized stability than the conventional spiro-OMeTAD under damp heat (85 °C and 85% relative humidity) conditions because of the robust inorganic HEM.
We have investigated the charge collection condition around voids in copper indium gallium sulfur selenide (CIGSSe) solar cells fabricated by sputter and a sequential process of selenization/sulfurization. In this study, we found direct evidence of void passivation by using the junction electron beam induced current method, transmission electron microscopy, and energy dispersive X-ray spectroscopy. The high sulfur concentration at the void surface plays an important role in the performance enhancement of the device. The recombination around voids is effectively suppressed by field-assisted void passivation. Hence, the generated carriers are easily collected by the electrodes. Therefore, when the S/(S + Se) ratio at the void surface is over 8% at room temperature, the device performance degradation caused by the recombination at the voids is negligible at the CIGSSe layer.
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