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A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for both individual devices/MMICs and multichip module (NICM) applications. It also has low-loss wideband RF transitions which are necessary to overcome manufacturing tolerances which leads to lower per unit cost. Novel applications of this new packaging architecture which go beyond the standard rec]uirements of device protection include: integration of antennas, compatibility to photonic networks and direct transitions p waveguide systems are described. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. 3D electromagnetic analysis was performed using the Finite-Difference Time-Domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. Novel multi-material system concepts which allow excellent surface finishes to be obtained (rcxlucing RF loss) and enhance thermal management (AIN, Cu, and diamond thin films) have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.

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