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A novel electrically conductive adhesives (ECAs) with solder particle have been developed. The kinetics of the curing reaction were investigated using isothermal differential scanning calorimeter (DSC). The dynamic DSC scans were also conducted to investigate the temperature dependant curing degree. The temperature dependant viscosity characteristic of polymer was investigated using rheometer. The wetting characteristic of two solders on two kinds of metals were investigated using an optical microscope. It was found that developed resin material showed good fluxing capacity against Sn-Bi solder on Ni/Au and the wetting angles was about 24º.

The interfacial reaction between Cu pad coated with Au/Ni and solder bump of flip chip package, using Sn97.5wt.%-Ag2.5wt%, was studied under thermal shock stress. All joints were subjected to thermal shock test with -65℃/+150℃ temperature range. For the Sn-2.5Ag solder, a scallop-like (Cu,Ni) 6 Sn 5 intermetallic compound was formed in the solder matrix after 20 cycles of thermal shock. (Cu,Ni) 6 Sn 5 was detached from the interface as (Ni,Cu) 3 Sn 4 grew underneath the (Cu,Ni) 6 Sn 5 IMC(Intermetallic Compound), whereas the elements of Sn, Ni and Cu were moved by interdiffusion at the interface between solder alloy and Cu pad. The composition of the IMCs in the solder joints and elemental distribution across the joint interfaces were quantitatively measured with EPMA (electron probe micro analysis). Finally, it was found that the crack initiation point and its propagation path could be influenced by the thermal shock conditions, two underfills, and their properties.