Nickel iron (NiFe) thin films were prepared on the copper substrate by ultrasonic assisted pulse electrodeposition under galvanostatic mode. Careful control of the thin films deposition is essential as the electrical properties of the films could be greatly affected, particularly if low quality films are produced. The preparation of NiFe/Cu thin films was aimed to reduce the grain size of NiFe particles, surface roughness and electrical resistivity of the copper substrates. Various parameters were systematically studied including current magnitude, deposition time and ultrasonic bath temperature. The optimized conditions to obtain NiFe permalloy, which subsequently applied to all investigated samples, were found at a current magnitude of 70 mA deposited for a duration of 2 min under ultrasonic bath temperature of 27 °C. The composition of NiFe permalloy was as close as Ni 80.71% and Fe 19.29% and the surface roughness was reduced from 12.76 nm to 2.25 nm. The films electrical resistivity was decreased nearly sevenfold from an initial value of 67.32 μΩ cm to 9.46 μΩ cm.

Varied compositions in the barium strontium titanate ternary system were prepared through the slow injection sol-gel technique. Nickel dopant was introduced through a general formula of Ba1 −xSrxTi1 −yNiyO3 (x = 0•4 and 0•5; y = 0•1 and 0•4 mol-%). Thermogravimetric analysis revealed that barium strontium titanate gels were completely dried and stabilised at 1000°C. All barium strontium titanate samples were confirmed as phase pure perovskite by qualitative X-ray diffraction analysis in which Nickel-doped subsolidus solution was formed successfully after calcinations at 1000°C. On the other hand, there was a sign of agglomeration discernible in the prepared BST samples and the grain sizes were found to be in the range of 39•66-71•87 nm.

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